SINCE 20243 nm
K3P
- Status
- Volume
- D0
- 0.05 /cm²
- Lead time
- 14 wk
10⁻¹ m
— The wafer · 300 mm
Every ångström counts.
Advanced foundry and packaging. The K2 2 nm-class process is in risk production for design partners.
In testing0.08 /cm² D0 on K2 risk lots · Q3 2026
CONVERSION · HERO
Primary: Request capacity (buyers). Secondary: PDK (engineers), lock icon sets expectation of a gate. Zoom is native scroll, no hijack.
10⁻⁹ m — The roadmap
Four nodes, four honest states.
SINCE JAN 20262 nm-class GAA
K2
- Status
- Risk prod.
- Perf.
- +14 %
- Power
- −28 %
2028Backside power
K2P
- Status
- Development
- Perf.
- +8 % vs K2
- Density
- +10 %
203014 Å-class
K1.4
- Status
- Research
- Litho
- High-NA EUV
- PDK 0.1
- 2028
PPA vs. K3P at iso-power · targets are forward-looking · illustrative
10⁻³ m — Capacity & packaging
From shuttle to volume.
Foundry wafers
K3P volume and K2 risk production, 300 mm.
K3P volume and K2 risk production, 300 mm.
Advanced packaging
2.5D interposer and 3D hybrid bonding at 9 µm pitch.
2.5D interposer and 3D hybrid bonding at 9 µm pitch.
MPW shuttles
Multi-project wafers for prototypes, four per year.
Multi-project wafers for prototypes, four per year.
Next K2 MPW shuttle: 18 Nov 2026
14 of 40 slots open · tape-out closes 21 Oct Reserve a slot →
14 of 40 slots open · tape-out closes 21 Oct Reserve a slot →
K2 wafer map
LOT 26-114 · WAFER 07 · 300 mm
10⁰ — For engineers
K2 PDK, behind NDA and export control.
Design rules, SPICE models, standard cells and memory compilers. Three short steps; most requests clear in 5 business days.
K2 design rule manual v0.9
EAR · CONTROLLED
EAR · CONTROLLED
K2 SPICE models, TT/FF/SS
EAR · CONTROLLED
EAR · CONTROLLED
Standard-cell library, 6T
EAR · CONTROLLED
EAR · CONTROLLED
10⁰ — Next step
Reserve wafers on K2.
Three inputs are enough for a first quote. A process engineer replies within 2 business days.